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Key words: Graphene | Filler materials | Al-based silicon carbide

CVD封装石墨烯导热片

应用高分子聚合物通过CVD技术将石墨烯导热材料封装制备而成,具有良好的导热、轻质、绝缘性好、可靠性高等优异性能,应用在电子、通信设备中,可替代部分超薄均热板的应用。


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Graphene thermal pad

Related Products

Spacer

Double-Sided Cooling technology is a new structural technology for power module in recent years. It effectively reduces the parasitic inductance and resistance for the device, and effectively improves the power density and reliability. Spacer works as essential components in the Double-Sided Cooling package. Spacers play the role of "heat conduction", "electric conduction" and "structure support".

Baseplate

AlSiC baseplate is widely used in high power IGBT module packaging because of its good thermal physical mechanical properties.

Housing

With the continuous development of diamond tools in the machining industry, AlSiC can be machined into housing with various shapes. AlSiC housing are used as packaging materials in thermal management because of excellent thermal physical and mechanical properties, light weight and good air tightness.

Graphene film

Graphene thermal conductive film has the characteristics of excellent thermal conductivity, lightweight, softness, and customizable thickness, and it’s a good thermal conductive material for the heat dissipation solutions for current electronic products.

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