Key words: Graphene | Filler materials | Al-based silicon carbide
Graphene thermal pad
Graphene thermal pad forms continuous and efficient thermal conductive networks though highly oriented graphene along the thickness direction. The product shows notable compression and rebound performace, which gives low interfacial thermal resistance when applied even at low pressure. It can be effectively filled between thermal interfaces to achieve highly efficient heat dissipation.
Double-Sided Cooling technology is a new structural technology for power module in recent years. It effectively reduces the parasitic inductance and resistance for the device, and effectively improves the power density and reliability. Spacer works as essential components in the Double-Sided Cooling package. Spacers play the role of "heat conduction", "electric conduction" and "structure support".
With the continuous development of diamond tools in the machining industry, AlSiC can be machined into housing with various shapes. AlSiC housing are used as packaging materials in thermal management because of excellent thermal physical and mechanical properties, light weight and good air tightness.
Graphene thermal conductive film has the characteristics of excellent thermal conductivity, lightweight, softness, and customizable thickness, and it’s a good thermal conductive material for the heat dissipation solutions for current electronic products.