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Key words: Graphene | Filler materials | Al-based silicon carbide

Aluminum-based silicon carbide composites (Spacer)

Spacer uses aluminum-based silicon carbide as the substrate and its thermal expansion coefficient matches that of the chip, and its mechanical stress is reduced. It plays the role of heat conduction, electric conduction and support. With the use of the double-sided cooling and heat dissipation structure of Spacer, the volume of the power semiconductor module is reduced, the thermal resistance is lowered, and the junction temperature can be significantly reduced, which can improve the power output and service life.






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Double-Sided Cooling technology is a new structural technology for power module in recent years. It effectively reduces the parasitic inductance and resistance for the device, and effectively improves the power density and reliability. Spacer works as essential components in the Double-Sided Cooling package. Spacers play the role of "heat conduction", "electric conduction" and "structure support".


AlSiC baseplate is widely used in high power IGBT module packaging because of its good thermal physical mechanical properties.


With the continuous development of diamond tools in the machining industry, AlSiC can be machined into housing with various shapes. AlSiC housing are used as packaging materials in thermal management because of excellent thermal physical and mechanical properties, light weight and good air tightness.

Graphene film

Graphene thermal conductive film has the characteristics of excellent thermal conductivity, lightweight, softness, and customizable thickness, and it’s a good thermal conductive material for the heat dissipation solutions for current electronic products.

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